Hero Electronix, the parent company of Tessolve, launched another brand under its umbrella last week. The new brand – Qubo – will launch a series of AI-powered intelligent home appliances, catering to the country’s smart home ecosystem.
Tessolve, a global provider of engineering solutions, has announced its partnership with the TSMC Design Center Alliance (DCA) program, part of the TSMC Open Innovation Platform® (OIP). This collaboration will focus on chip implementation and system-level design solutions, leveraging Tessolve’s expertise in IC design, testing, and embedded systems development. With a strong emphasis on TSMC’s industry-leading process technologies, the partnership aims to simplify and accelerate projects for customers in various sectors, including AI, IoT, automotive, and more. Tessolve’s comprehensive services, combined with TSMC’s advanced process technologies, will help reduce barriers and facilitate more efficient semiconductor and electronics designs.
Tessolve strengthened its work in the field of Near Field Communication (NFC) based on hybrid technology work as the industry transitioned into the new technological world by adding automation process assistance for NFC tags, barcode scanning, and QR Code scan testing for OEMs/Device Vendors.